bav756dw document number: ds30148 rev. 9 - 2 1 of 3 www.diodes.com april 2008 ? diodes incorporated bav756d w quad surface mount switching diode array features ? fast switching speed ? ultra-small surface mount package ? for general purpose switching applications ? high conductance ? one bav70 circuit and one baw 56 circuit in one package ? easily connected as full wave bridge ? lead free/rohs compliant (note 3) ? "green" device (notes 4 and 5) mechanical data ? case: sot-363 ? case material: molded plasti c, ?green? molding compound. ul flammability classification rating 94v-0 ? moisture sensitivity: level 1 per j-std-020d ? terminals: solderable per mil-std-202, method 208 ? lead free plating (matte tin finish annealed over alloy 42 leadframe). ? polarity: see diagram ? marking information: see page 2 ? ordering information: see page 2 ? weight: 0.006 grams (approximate) sot-363 c 1 a 2 a 1 a 1 c 2 c 2 top view internal schematic top view maximum ratings @t a = 25c unless otherwise specified characteristic symbol value unit non-repetitive peak reverse voltage v rm 100 v peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 75 v rms reverse voltage v r(rms) 53 v forward continuous current (notes 1 and 2) i fm 300 ma average rectified output current (notes 1 and 2) i o 150 ma non-repetitive peak forward surge current @ t = 1.0 s @ t = 1.0s i fsm 2.0 1.0 a thermal characteristics characteristic symbol value unit power dissipation (notes 1 and 2) p d 200 mw power dissipation t s = 60 c (note 2) p d 300 mw thermal resistance junction to ambient air (notes 1 and 2) r ja 625 c/w thermal resistance junction to soldering point (note 2) r js 275 c/w operating and storage temperature range t j , t stg -65 to +150 c electrical characteristics @t a = 25c unless otherwise specified characteristic symbol min max unit test condition reverse breakdown voltage (note 6) v (br)r 75 ? v i r = 2.5 a forward voltage v f ? 0.715 0.855 1.0 1.25 v i f = 1.0ma i f = 10ma i f = 50ma i f = 150ma reverse current (note 6) i r ? 2.5 50 30 25 a a a na v r = 75v v r = 75v, t j = 150 c v r = 25v, t j = 150 c v r = 20v total capacitance c t ? 2.0 pf v r = 0, f = 1.0mhz reverse recovery time t rr ? 4.0 ns i f = i r = 10ma, i rr = 0.1 x i r , r l = 100 notes: 1. device mounted on fr-4 pc board with recommended pad layout, which can be found on our website at http://www.di odes.com/datas heets/ap02001.pdf. 2. one or more diodes loaded. 3. no purposefully added lead. 4. diodes inc.'s "green" policy can be found on our w ebsite at http://www.diodes.com /products/lead_free/index.php. 5. product manufactured with date code uo (week 40, 2007) an d newer are built with green molding compound. product manufactur ed prior to date code uo are built with non-green molding compound and may contain halogens or sb 2 o 3 fire retardants. 6. short duration pulse test used to minimize self-heating effect.
bav756d w 0 50 100 150 200 250 25 0 50 75 100 125 150 p , p o we r dissi p a t i o n (mw) d t , ambient temperature ( c) a fig. 1 power derating curve, total package 300 note 1 0.1 1 0.01 0.001 0 1.5 1.0 0.5 i, i n s t a n t a n e o u s f o r wa r d c u r r e n t (a) f v , instantaneous forward voltage (v) fig. 2 typical forward characteristics, per element f 0.1 1 10 100 1,000 10,000 0 20 40 60 80 100 v , instantaneous reverse voltage (v) fig. 3 typical reverse characteristics, per element r i , instantane o u s r eve r se c u r r ent (na) r 0.0 0.2 0.4 0.6 0.8 1.8 1.6 1.4 1.2 1.0 2.0 0 10 20 40 30 c , t o t al c a p a c i t an c e (p f ) t v , dc reverse voltage (v) fig. 4 total capacitance vs. reverse voltage, per element r f = 1.0mhz ordering information (notes 5 & 7) bav756dw document number: ds30148 rev. 9 - 2 2 of 3 www.diodes.com april 2008 ? diodes incorporated part number case packaging bav756dw-7-f sot-363 3000/tape & reel notes: 7. for packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf . marking information kca ym kca = product type marking code ym = date code marking y = year ex: n = 2002 m = month ex: 9 = september date code key year 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2111 2012 code m n p r s t u v w x y z month jan feb mar apr may jun jul aug sep oct nov dec code 1 2 3 4 5 6 7 8 9 o n d
bav756d w package outline dimensions bav756dw document number: ds30148 rev. 9 - 2 3 of 3 www.diodes.com april 2008 ? diodes incorporated suggested pad layout important notice diodes incorporated and its subsidiaries rese rve the right to make modifications, enhanc ements, improvements, corrections or ot her changes without further notice to any product herein. diodes incorporat ed does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its paten t rights, nor the rights of others. the user of products in such applications shall assume all risks of such use and will agree to hold diodes inco rporated and all the companies whose products ar e represented on our website, harmless against all damages. life support diodes incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the president of diodes incorporated. a m j l d b c h k f sot-363 dim min max a 0.10 0.30 b 1.15 1.35 c 2.00 2.20 d 0.65 nominal f 0.30 0.40 h 1.80 2.20 j ? 0.10 k 0.90 1.00 l 0.25 0.40 m 0.10 0.25 0 8 all dimensions in mm x z y c e e g dimensions value (in mm) z 2.5 g 1.3 x 0.42 y 0.6 c 1.9 e 0.65
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